Grinding tool and method of manufacturing the grinding tool

ABSTRACT

A manufacturing method for grinding tool includes following steps. Step 1 is providing a substrate. Step 2 is fixing diamond or abrasive grit in a predetermined position or base by DIAMAP (Diamond Implant Array Mapping &amp; Arrangement Process). The last step is providing a second fixing layer onto the first fixing base and the exposed surface of the substrate. The first fixing base and the second fixing layer are used for fixing the abrasive grits on the substrate. Moreover, a grinding tool is provided in the present invention.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a grinding tool and a method of manufacturing the grinding tool, and more particularly to a grinding tool with higher grinding performance and a method of manufacturing the grinding tool.

2. Description of Related Art

With development of the semiconductor industry, many tools are used in the manufacturing processes. For example, to obtain smooth and flat surface of wafer, chemical mechanical polishing (CMP) process is widely used for achieving the planarization of the wafer. In the CMP process, the wafer is covered by a disk and pressed on the rotating polishing pad, and then the acidic or alkali polishing liquid is injected on the polishing pad to conduct the polishing process.

The grinding tool is a metal disk with diamond powders on the surface thereof and the grinding tool can be used for conditioning the polishing pad. The grinding tool also called as diamond disk and the diamond disk is used for conditioning the polishing pad so as to improve the polishing efficiency. Furthermore, the diamond disk can be used for removing the polished particles and sludge from the polishing pad.

Please refer to FIG. 1; the traditional grinding tool 1 a is formed by brazing 12 a the diamond powders 11 a onto the metal substrate 10 a. In the traditional method, the diamond powders 11 a are randomly arranged on the metal substrate 10 a. Therefore, the grinding performance can't be designed and controlled.

Another method is provided to manufacture the grinding tool. A supporter with meshes is assembled on a substrate and diamond powders are disposed in the meshes and arranged on the substrate. Then, a high temperature sintering process is provided to fix the diamond powder on the substrate. However, the meshes have limited sizes and it is not suitable for small-sized diamond powders. Moreover, the temperature of the sintering process is too high to maintain the quality of diamond powders. Therefore, the diamond powder has carbonization issue resulted from a high temperature process and the powders are easily broken during the conditioning process. Still further, the arrangement of the mesh is not adjustable so that the distribution of the diamond powders, such as particle size, arrangement pattern and density, is limited and non-designable. Thus, the traditional grinding tool cannot be used in various dressing conditions.

Therefore, there is a need to provide a novel structure that can overcome the shortages of the prior art.

SUMMARY OF THE INVENTION

It is one object of the present invention to provide a grinding tool and a method of producing the tool. The manufacturing method has low temperature process so that the carbonization issue resulted from a high temperature sintering process of the traditional method can be solved. Furthermore, the arrangement pattern, the fixing depth and the particle size of the abrasive grits can be controlled. Therefore, the grinding or conditioning performance of the grinding tool of the present invention can be improved.

To achieve the above-mentioned objectives, the present invention provides a manufacturing method of a grinding tool. The manufacturing method includes following steps. Step 1 is providing a substrate. Step 2 is fixing abrasive grits to the pre-determined base on substrate by Diamond Implant Array Mapping & Arrangement Process (DIAMAP). Step 3 is forming a second fixing layer to cover the first fixing base and the exposed substrate. The first fixing base and the second fixing layer are used for fixing the abrasive grits on the substrate.

The DIAMAP of the present invention includes three steps. First step is forming the receiving portions on the substrate. Next step is implanting the abrasive grit(s) into the receiving portions. Third step is fixing the abrasive grit(s) on the substrate by the first fixing base and then removing the receiving portions.

The present invention further provides a grinding tool. The grinding tool includes a substrate and a plurality of abrasive grits regularly arranged on the substrate. The contact positions of abrasive grits and the substrate are respectively covered by a first fixing base. Moreover, the first fixing base and the exposed surface of the substrate are covered by a second fixing layer. Therefore, the abrasive grits are regularly fixed on the substrate so as to form a grinding surface pattern.

The present invention provides the following advantages. The abrasive grits are fixed on the substrate by the first fixing base and the second fixing layer. In other words, the method of the present invention does not include high temperature forming processes, such as a sintering process. Therefore, the strength of the abrasive grits is not changed or degraded as the traditional process so that the abrasive grits are not easily broken. Moreover, the structures of the receiving portions, such as distribution density, opening sizes of the receiving portions, can be adjusted and the distribution density and the size of the abrasive grits are also adjustable. On the other hand, the receiving portions can be formed in partial areas of the substrate so that the abrasive grits can be fixed only in designed working areas. Accordingly, the grinding or conditioning performance of the tool of the present invention can be improved.

In order to further understand the techniques, means and effects, the present invention takes for achieving the prescribed objectives, the following detailed descriptions and appended drawings are hereby referred; such that, through which the purposes, features, and aspects of the present invention can be thoroughly and concretely appreciated; however, the appended drawings are merely provided for reference and illustration, without any intention to be used for limiting the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a traditional grinding tool.

FIG. 2 shows a manufacturing method of a grinding tool according to the present invention.

FIG. 3 shows a manufacturing method of the first embodiment of a grinding tool according to the present invention.

FIG. 4 is a schematic view of the first embodiment of a grinding tool according to the present invention.

FIG. 4A is a schematic view of the second embodiment of a grinding tool according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 2 and 4, the present invention provides a manufacturing method of a grinding tool 1. The manufacturing method is applied for arranging and fixing the abrasive grits 20 regularly on the surface of the substrate 10 so that the grinding tool 1 can be used in high precision grinding or conditioning process. On the other hand, the grinding tool 1 is manufactured in low temperature process so as to solving the high temperature degradation problem of the abrasive grits 20. The manufacturing method includes the following steps (please refer to FIG. 3).

Step S101 is providing a substrate 10. In the embodiment, the substrate 10 is made of stainless steel, but not restricted thereby. For example, the substrate 10 can be made of metal materials, such as aluminium alloy, titanium alloy, or alloy steel, or be made of ceramic material, such as oxide ceramic material, carbide ceramic material, or nitride ceramic material, or be made of high hardness plastics. In other words, the material of the substrate 10 is not limited and the substrate 10 has a property of hardness (with a rigid surface) for forcing on the object and for resisting the reactive force.

Step S102 is fixing the abrasive grits 20 on the surface of the substrate 10 by a method of DIAMAP (Diamond Implant Array Mapping & Arrangement Process). The method of DIAMAP includes step S1021 to Step 1024. Step S1021 is forming a plurality of receiving portions on the substrate 10. In other words, the receiving portions are regularly formed on the surface of the substrate 10 so that the abrasive grits 20 can be fixed into the receiving portions. Thus, the abrasive grits 20 can be arranged regularly on the substrate 10. The receiving portions can be formed by semi-conductor manufacturing method, micro electro mechanical method, press-printing, screen-printing, inking, laser-forming or electrical discharge machining. Alternatively, an auxiliary layer with the receiving portions can be formed on the substrate 10. The receiving portions are formed on the auxiliary layer by semi-conductor manufacturing method or micro electro mechanical method, or by applying physical and chemical properties of the auxiliary layer. The receiving portions are regularly arranged and the shape and the opening size of the receiving portion can be adjusted. In addition, the distance between the adjacent receiving portions also can be adjusted. In the embodiment, the opening size of the receiving portion is ranged from 10 to 500 um and the receiving portions can have various opening sizes.

Step S1022 is implanting the abrasive grits 20 into the receiving portions so that at least one abrasive grit 20 can be accommodated in a single receiving portion. The abrasive grits 20 are preferably and regularly received inside the receiving portions. The size of the abrasive grits 20 is chosen according to the opening size of the receiving portion. In the embodiment, the abrasive grits 20 are micro or nano diamond grits for providing into the receiving portions. Alternatively, the abrasive grits 20 can be diamond powders, carbide ceramic powders, oxide ceramic powders, or nitride ceramic powder, and so on, and particle sizes of the abrasive grits 20 are ranged from 100 nm to 500 um.

Step S1023 is forming a first fixing base 30 in each of the receiving portions for fixing the abrasive grits 20 on the substrate 10. In the embodiment, the first fixing base 30 of nickel material is formed on a contact position of the abrasive grit 20 and the substrate 10 by electro-forming method. The first fixing base 30 of nickel material is used for connecting the bottom of the abrasive grit 20 with the substrate 10 so that the abrasive grits 20 can be fixed on the substrate 10. On the other hand, the isolation process of the electro-forming method is well known to the skilled person. However, another deposition method can be provided such as PVD or CVD method and the first fixing base 30 can be made of metal (i.e., titanium, copper, or aluminum), ceramic, composite materials, or diamond.

Step S1024 is removing the receiving portions. The receiving portions are removed and the abrasive grits 20 are fixed on the substrates without the receiving portions. In the embodiment, the receiving portions can be removed by a chemical method, but not restricted thereby.

Next, Step S103 is providing for forming a second fixing layer 40 to cover the substrate 10. The second fixing layer 40 covers the first fixing base 30 and the exposed surface of the substrate 10, which is exposed after the receiving portions being removed. The second fixing layer 40 is used for improving the connection strength of the abrasive grits 20 and the substrate 10 so that the abrasive grits 20 can be used against the grinding force and be applied in the grinding or conditioning process. Similarly to the first fixing base 30, the second fixing layer 40 can be formed by an electro-plating method, a chemical plating method, PVD or CVD method. On the other hand, the second fixing layer 40 is a metal layer, a ceramic layer, a composite-material layer, or a diamond layer formed by a vapor growth process. By the second fixing layer 40, the abrasive grits 20 can be attached on the substrate 10 with high connection strength.

Accordingly, the grinding tool 1 is manufactured by the above-mentioned steps. The grinding tool 1 includes a substrate 10 and a plurality of abrasive grits 20 regularly arranged on the substrate 10. The contact positions of abrasive grits 20 and the substrate 10 are respectively covered by a first fixing base 30. Moreover, the first fixing base 30 and the exposed surface of the substrate 10 are covered by a second fixing layer 40. Therefore, the abrasive grits 20 are regularly fixed on the substrate 10 so as to form a grinding surface pattern to conduct the grinding or conditioning process. The materials and the manufacturing methods of the substrate 10, the abrasive grits 20, the first fixing base 30, and the second fixing layer 40 are shown in the above-mentioned description.

Furthermore, the structure of the grinding surface patterns can be adjusted in the Step S1021. For example, the receiving portions are distributed on some portion of the substrate surface (i.e., the receiving portions are not formed on the entire substrate surface). Therefore, the abrasive grits 20 can be arranged on the surface of the substrate 10 with the receiving portions, but not implanted to the surface of the substrate 10 without the receiving portions in the Step S1022. By the formation of the receiving portions, the grinding surface pattern can have a non-filled area 202 and a working area 201. Please refer to FIG. 4A, the grinding surface pattern has there non-filled areas 202 which have no abrasive grit 20 thereon and there working areas 201 which have abrasive grits 20 thereon. In the grinding process, the non-filled areas 202 are used for improving the material removing rate of the particles. On the other hand, the receiving portions can be distributed with different densities or concentration on the auxiliary layer so that the abrasive grits 20 can also be distributed with different densities or concentration on the surface of the substrate 10.

In light of the foregoing above, the present invention provides the following advantages.

1. The manufacturing steps and methods used in the present invention are classified as a low-temperature manufacturing process. Therefore, the carbonization issue resulted from a high temperature process of the traditional method can be solved. The grinding tool of the present invention provides improving grinding or conditioning performance.

2. Depending on the DIAMAP method of the present invention, the receiving portions can be arranged on the substrate in various distributions. Therefore, the grinding tool of the present invention can have various grinding surface patterns for applying to different applications. For example, the distance pitch between the adjacent abrasive grits can be adjusted, or the smaller abrasive grits can be fixed on the substrate, or the distribution of the abrasive grits can have different densities or concentration and different working areas. The grinding ability of the grinding tool of the present invention is improved.

3. The arrangement of the abrasive grits and the protrusions of the abrasive grits can be controlled. Therefore, the grinding/dressing rate and the grinding/dressing efficiency can be precisely predicted. For the product quality, the grinding performance is easily controlled.

The above-mentioned descriptions represent merely the preferred embodiment of the present invention, without any intention to limit the scope of the present invention thereto. Various equivalent changes, alternations, or modifications based on the claims of present invention are all consequently viewed as being embraced by the scope of the present invention. 

1. A manufacturing method of a grinding tool, comprising: providing a substrate, the substrate having a plurality of receiving portions; fixing abrasive grits on the receiving portions of the substrate; forming a first fixing base in each of the receiving portions for fixing the abrasive grits on the substrate, and then removing the receiving portions; and forming a second fixing layer to cover the first fixing base and the exposed substrate, wherein the first fixing base and the second fixing layer are used for fixing and arranging the abrasive grits on the substrate.
 2. The manufacturing method of a grinding tool of claim 1, wherein the receiving portions is formed by semi-conductor manufacturing method, micro electro mechanical method, press-printing, screen-printing, inking, laser-forming or electrical discharge machining.
 3. The manufacturing method of a grinding tool of claim 1, wherein the receiving portions is formed by a step of forming an auxiliary layer with the receiving portions on the substrate.
 4. The manufacturing method of a grinding tool of claim 3, wherein the receiving portions are formed on the auxiliary layer by semi-conductor manufacturing method or micro electro mechanical method, or by applying physical and chemical properties of the auxiliary layer.
 5. The manufacturing method of a grinding tool of claim 1, wherein in the step of fixing abrasive grits on the receiving portions, micro or nano diamond grits are provided into the receiving portions, and each of the receiving portion has at least one diamond grit thereinside.
 6. The manufacturing method of a grinding tool of claim 1, wherein in the step of forming a first fixing base, the first fixing base is formed on a contact position of the abrasive grit and the substrate by electro-forming, electro-plating, electroless-plating, physical vapor deposition or chemical vapor deposition so that the abrasive grits are fixed on the substrate.
 7. The manufacturing method of a grinding tool of claim 6, wherein in the step of forming a first fixing base, the first fixing base of a metal layer, a ceramic layer, a composite material layer or a diamond layer is formed on the contact position of the abrasive grit and the substrate by electro-forming, electro-plating, electroless-plating, physical vapor deposition or chemical vapor deposition.
 8. The manufacturing method of a grinding tool of claim 1, wherein in the step of forming a second fixing layer, the second fixing layer is formed on the substrate by electro-plating, electroless-plating, physical vapor deposition or chemical vapor deposition so that the second fixing layer covers the first fixing base and the exposed substrate.
 9. The manufacturing method of a grinding tool of claim 8, wherein in the step of forming a second fixing layer, the second fixing layer of a metal layer, a ceramic layer, a composite material layer, or a diamond layer is formed on the substrate by electro-plating, electroless-plating, physical vapor deposition or chemical vapor deposition.
 10. A grinding tool, comprising: a substrate and a plurality of abrasive grits regularly arranged on the substrate, each of the abrasive grits contacting the substrate on a contact position, a first fixing base disposed on the contact position, a second fixing layer covered the first fixing base and the exposed substrate, wherein the abrasive grits are regularly fixed and arranged on the substrate to form a grinding surface pattern.
 11. The grinding tool of claim 10, wherein the substrate is made of metal materials, ceramic materials or high hardness plastics.
 12. The grinding tool of claim 11, wherein the ceramic materials include oxide ceramic material, carbide ceramic material, or nitride ceramic material, the metal materials include stainless steel, aluminium alloy, titanium alloy, or alloy steel.
 13. The grinding tool of claim 10, wherein the first fixing base is made of metal material, ceramic material, composite material, or diamond material.
 14. The grinding tool of claim 13, wherein the second fixing layer is made of metal material, ceramic material, composite material, or diamond material.
 15. The grinding tool of claim 10, wherein the grinding surface pattern includes at least one non-filled area and at least one working area, the abrasive grits are regularly fixed and arranged on the working area, and the non-filled area has no abrasive grit thereon.
 16. The grinding tool of claim 10, wherein the abrasive grits are arranged on substrate with various densities, the abrasive grits includes diamond powders, carbide ceramic powders, oxide ceramic powders, or nitride ceramic powder, and particle sizes of the abrasive grits are ranged from 100 nm to 500 um. 